Hybrid†Thermal Solution: ready for air and water cooling: Featuring sharp ROG design, the Hybrid†Thermal Solution heatsink integrates a 100% copper heatpipe and a water cooling channel with electroplated barb fittings to prepare you for air and water cooling. Boost heat removal from CPU VRMs, and achieve the overclocking and gaming stability advantage with double the flexibility.
- Intel LGA-775†
- Intel LGA-1366†
- Intel LGA-1150/1155/1156
- Intel LGA†2011
Enclosed in the box:†
- EK-Supreme LTX series water block†
- Classic†CPU mounting mechanism
Caution:†No backplate is included. EK†highly recommends†EK-LGA 115x†TRUE†Backplate†for all Intel LGA-1150/1155/1156 platform users! LGA-2011 requires no backplate. EK recommends†EK-Supremacy Backplate†for LGA-775 and LGA-1366 platform users.