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INTEL Core i3-7100 3.90
Price: Hardware Price List
Description
General information
Type CPU / Microprocessor
Market segment Desktop
Family
Intel Core i3
Model number 
i3-7100
CPU part numbers
  • CM8067703014612 is an OEM/tray microprocessor
  • BX80677I37100 is a boxed processor (English version)
  • BXC80677I37100 is a boxed processor (Chinese version)
Frequency  3900 MHz
Bus speed  8 GT/s DMI
Clock multiplier  39
Package 1151-land Flip-Chip Land Grid Array
Socket Socket 1151 / H4 / LGA1151
Size 1.48" x 1.48" / 3.75cm x 3.75cm
S-spec numbers
Part number Production processors
  SR35C
BX80677I37100 +
BXC80677I37100 +
CM8067703014612 +
Architecture / Microarchitecture
Microarchitecture Kaby Lake
Processor core  Kaby Lake-S
Core stepping  S0 (SR35C)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size  2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size  2 x 256 KB caches
Level 3 cache size 3 MB shared cache
Physical memory 64 GB
Multiprocessing Uniprocessor
Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64 
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology 
  • VT-x / Virtualization technology 
  • TSX / Transactional Synchronization Extensions
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
Low power features
  • Core C1/C1E, C3, C6, C7 and C8 states
  • Package C2, C3, C6, C7 and C8 states
  • Enhanced SpeedStep technology 
Integrated peripherals / components
Display controller
  • 3 displays
  • DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4
Integrated graphics GPU Type: Intel HD 630
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1100
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-2133, DDR4-2400
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 38.4
Other peripherals
  • Direct Media Interface 3.0 (4 lanes)
  • PCI Express 3.0 interface (16 lanes)
Electrical / Thermal parameters
Maximum operating temperature 100°C
Thermal Design Power 51 Watt
 Product detail (Click Here)